Bob Willis, President & Principal Consultant
Bob Willis, President & Principal Consultant
Bob Willis currently operates a training and consultancy business based in England. Bob is a member of the SMART Group technical committee. Although a specialist for companies implementing surface mount and area array technology Mr Willis provides training and consultancy in most areas of electronic manufacture. In the last 10 years focusing on lead-free manufacture which has eared him the SOLDERTEC/Tin Technology Global Lead-Free Award for his contribution to the industry. He has worked with the GEC Technical Directorate as Surface Mount Co-Ordinator for both the Marconi and GEC group of companies and prior to that he was Senior Process Control Engineer with Marconi Communication Systems, where he had worked since his apprenticeship. Following his time with GEC he became Technical Director of an electronics contract manufacturing company where he formed a successful training and consultancy division. As a process engineer, he was involved in all aspects of electronic production and assembly involved in setting up production processes and evaluating materials; this also involved obtaining company approval on a wide range of Marconi’s processes and products including printed circuit board manufacture for Ministry of Defence and British Telecom. During the period with Marconi, experience was gained in methods and equipment for environmental testing of components, printed boards and assemblies with an interest developed in many areas of failure and defect analysis. Over the last 30 years he has been involved in all aspects of conventional, surface mounted and area array, both at production and quality level and during that time has been involved in training sta and other engineers in many aspects of modern production.
Mr. Willis has traveled in the United States, Japan, China, New Zealand, Australia, South Africa and the Far East consulting and lecturing on electronic assembly. Mr. Willis was presented with the Paul Eisler award by the IMF (Institute of Metal Finishing) for the best technical paper during their technical programmes. He has conducted SMT Training programs for Texas Instruments and ran Reow and Wave Soldering Workshops in Europe for one of the largest suppliers. Mr Willis is an IEE Registered Trainer and has been responsible for training courses run by the ICT and PCIF originally one of Europe’s largest printed circuit associations. SMTA, Surface Mount Technology Association recently presented Bob with their International Leadership Award for continued contribution to industry. Bob has also been presented with IPC Committee Awards for contribution to IPC standards. Bob has conducted workshops and set up production lines, assembly features & his “NPL Process Advice and Defect Clinic” with all the major organisations and exhibition organisers World Wide like Productronica, Germany, IPC APEX, SMTAI in the US USA plus Nepcon and New in the UK. He is known for being an entertaining presenter and the only presenter to use unique process video clips during his workshops to demonstrate each point made. In the past few years he has set-up and run many online training sessions for customers via his webinar website and regularly runs webinars for other organisations.
Mr. Willis was Chairman of the SMART Group, European Surface Mount Trade Association from 1990-94 and has been elected Honorary President for life and currently holds the position of SMART Group Technical Manager, he also works on BSI Standards Working Parties. He is a Fellow of the Institute Circuit Technology, an NVQ Assessor, Member of the Institute of Quality Assurance and Society of Environmental Test Engineers. Bob Willis currently writes regular features for magazine. He was responsible for writing each of the SMART Group Charity Technology reports, which are sold in Europe and America by the SMTA to raise money for worthy causes. Bob Willis helped organise the SMART Group-Lead Free Mission to Japan for the Department or Trade and Industry (DTI) to examine and report on the current state of lead-free research and implementation of lead-free processes. Bob ran the SMART Group PPM Monitoring Project in the United Kingdom supported by the DTI and coordinator of the LEADOUT Project for the SMART Group. Bob organises the NPL Defects Database on behalf of NPL and organisers the Electronics Interconnection divisions online technology webinars and on site workshops. He has also authored two books in the last couple of years on Pin In Hole Intrusive, Design & Assembly plus Package On Package Design Assembly & Quality Control which has been read by over 2000 engineers.