National Electronic Packaging Conference (NEPCON) Workshop Series | 6– 8 June 2017 | Equatorial Hotel, Penang, Malaysia

NEPCON workshop series gathers experts from around the world under one roof. Everything you need to know about Electronic Packaging and be at par with the changing technology is presented in this NEPCON workshop series. Our workshops feature innovative solutions for our Malaysian Electronics Industry and identifies drivers to our competitive advantage. Gain new insights and solutions on improving your assembly processes, reducing defects, improving reliability and resolving issues on assembly of challenging components!

PCB Assembly

Workshop A: Rework and Repair – Process Optimisation, Failure Modes & Tricks of the Trade (6th June 2017)

Bob Willis, President & Principal Consultant, Bobwillisonline.com, ENGLAND

Workshop B: Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination (8th June 2017)

Bob Willis, President & Principal Consultant, Bobwillisonline.com, ENGLAND

Workshop C: Defect Analysis and Process Troubleshooting (6th June 2017)

Phil Zarrow, President & Principal Consultant, ITM Consulting, USA

Soldering

Workshop D Achieving High Reliability of Solder Joints (6th June 2017)

Dr. Ning-Cheng Lee, Vice President of Technology, Indium Corporation, USA

Workshop E: Choosing Solders for the New Era (7th June 2017)

Dr. Ning-Cheng Lee, Vice President of Technology, Indium Corporation, USA

Workshop F: Reflow – Understanding the Complete Process & Defect Prevention (7th June 2017)

Bob Willis, President & Principal Consultant, Bobwillisonline.com, ENGLAND

Workshop G: DFX for Advanced Soldering Technology (8th June 2017)

Dr. Ning-Cheng Lee, Vice President of Technology, Indium Corporation, USA

IC Packaging

Workshop H: Wafer level Fan Out 3D Advanced Packaging Assembly and Technology: from Smart Phones to Computers (6th & 7th June 2017)

Dr. Thomas Dory, Research & Development Manager, Fujifilm Electronic Materials, USA

Workshop I: Failure Analysis and reduction in Semiconductor Package Assembly (8th June 2017)

Dr. Thomas Dory, Research & Development Manager, Fujifilm Electronic Materials, USA

Process Optimization

Workshop J: Optimizing Assembly Processes in PCBA to Improve Manufacturing Productivity and Reliability (7th & 8th June 2017)

Phil Zarrow, President & Principal Consultant, ITM Consulting, USA

Workshop K: Productivity Improvement for World Class Manufacturing (WCM) (6th, 7th, 8th June 2017)

Shuras Vasu, Associate Consultant, MALAYSIA

Printed Circuit Board

Workshop L: Advanced Methods of Preventing Failures in Printed Circuit Boards (6th June 2017)

Bhanu Sood, Commodity Risk Assessment Engineer, Reliability and Risk Assessment Branch, NASA Goddard Space Flight Center, USA

Workshop M: Improving Reliability and Failure Analysis of Electronics (7th & 8th June 2017)

Bhanu Sood, Commodity Risk Assessment Engineer, Reliability and Risk Assessment Branch, NASA Goddard Space Flight Center, USA

For registration & quotations please contact +603 21701588 or email to richmondy@knowledgegroupco.com.